Sensors for temperature, pressure, and humidity
Rob Twiney, GE Sensing
Venue: BAWA Filton
Wednesday February 18, 2009 at 19:30
The reducing cost of electronics processing power is allowing micro-computers to be integrated into a wider range of systems increasing their functionality at reduced cost. This availability of processing power is also driving an increase in the need for a range of sensor types to allow the microprocessor to interact with the real world. This presentation will overview some of the most common sensor types and technologies, particularly temperature, humidity and pressure transducers. Their mode of operation and related material issues will be discussed and reviewed. The presentation will also look at some of the problems in packaging next generation sensors with integrated electronics.
|
| Corvette and Evolution series locomotive |
|---|
